Ultrasonic Inspection Equipment

■ Semiconductor (Wafer)

■ Automotive (Power module/DCB, etc.)

■ Automated System for SAT

 - Single / Dual / Quadruple / Array Solutions

■ Analyzes defects such as voids, cracks, and delamination inside specimens invisible to the naked eye using ultrasonic signals with real-time imaging

■ Acquires 3D high-resolution images of micro defects through ultrasonic probe scanning with various frequencies for specific inspection applications, evaluating defect size and location

■ 100% inspection through full automation

■ Defect inspection of upper and lower bonding surfaces of DCB substrates

■ Defect inspection of upper and lower brazing bonding surfaces of AMB substrates

■ Inspection of incomplete filling defects at solder bonding surfaces between power semiconductor chips and DCB/AMB substrates, and at lower base plate solder bonding surfaces

■ Inspection of voids, cracks, delamination, and other defects at upper and lower bonding surfaces of DCB/AMB substrates

■ Inspection of TGV (Through Glass Via) hole filling in Glass interposer & Glass substrates

■ Inspection of voids, cracks, and delamination at Glass & Copper bonding surfaces

■ Inspection of LED chip soldering fill condition

■ Inspection of cracks, voids, and delamination inside micro bumps at HBM bonding surfaces

■ Inspection of voids and delamination in Cu hybrid inner layers at HBM bonding surfaces

■ Inspection of voids inside die underfill

■ Inspection of voids and delamination inside Cu-to-Cu hybrid bonding surfaces during Cell + Peri stacking

■ Inspection for void presence inside underfill of 2.5D/3D packaging structures

■ Defect inspection of voids, delamination, and foreign material contamination inside MLCC chips