SAT Inspection Systems

Business

Ultrasonic (SAT) Inspection Systems

SFSAT-W (Wafer)

▪ Full Auto SAT for Wafer

▪ Multi Probe Head

▪ Transducer Frequency: 50~250MHz

▪ Scan Area: 300X300(mm)

▪ External Dimension: 1750X2200X2000(mm)

SFSAT-PAC (Advanced Package)

▪ Full Auto SAT for Package

▪ Multi Probe Head

▪ Transducer Frequency: 25~200MHz

▪ Scan Area: 300X200(mm)

▪ External Dimension: 3200X2000X2150(mm)

SFSAT-P (Power Module)

▪ Full Auto SAT for Power Module

▪ Multi Probe Head

▪ Transducer Frequency: 50~200MHz

▪ Scan Area: 300X200(mm)

▪ External Dimension: 3400X1800X2080(mm)

SFSAT-S (Substrate)

▪ Full Auto SAT for Substrate

▪ Multi Probe Head

▪ Transducer Frequency: 75MHz

▪ Scan Area: 200X200(mm)

▪ External Dimension: 5500X2000X2170(mm)

SFSAT-M (Manual)

▪ Full Auto Manual SAT

▪ Single or Multi Probe Head

▪ Transducer Frequency: 50~200MHz

▪ Scan Area: 300X200(mm)

▪ External Dimension: 840X1150X1960(mm)

Model differences at a glance

SFSAT models are divided by the form of the sample. Multi-probe parallel scanning (two or more inspection zones configurable), real-time warpage compensation of ±3 mm, a maximum scan speed of 1,200 mm/s, non-immersion coupling, deep-learning-based automatic judgment and SECS/GEM integration are common to all models.

Model	Sample	When to choose it	Transducer	Scan area
SFSAT-W	Wafer	100% in-line inspection of voids and particles at wafer-bonding interfaces and in stacked wafers	50–250 MHz	300 × 300 mm
SFSAT-PAC	Advanced package	Underfill voids, bump cracks and delamination in FC-BGA, 2.5D/3D and chiplet packages	25–200 MHz	300 × 200 mm
SFSAT-P	Power semiconductor module	Solder and sintered-joint voids between DCB/AMB substrate, chip and base plate	50–200 MHz	300 × 200 mm
SFSAT-S	Substrate	Internal cracks and delamination in ceramic and multilayer ceramic substrates	75 MHz	200 × 200 mm
SFSAT-M	General (manual loading)	Research, failure analysis and low-volume, high-mix samples that need no automatic loader; single or multi-probe head	50–200 MHz	300 × 200 mm

Higher frequency gives finer resolution and shallower penetration. Throughput depends on scan pitch and on the number of probes and inspection zones, so it must be compared under the same conditions and is advised after evaluation of the sample. For the principle and terminology, see the SAT Technology Guide.