MIT is a global leader in developing fully automated inline ultrasonic inspection equipment for detecting internal defects in advanced high-spec memory and packages in the advanced/power semiconductor field.
MIT develops equipment that automatically inspects and analyzes ultra-fine internal defects in wafers, chips, and packages at every stage — from development to mass production, from front-end to back-end semiconductor processes — and applies them in mass production for the world's leading semiconductor companies.
Furthermore, based on our world-class inspection precision and fast inspection speed, we help improve the production stability and quality of our customers' products, ultimately contributing to the improvement of their final profits. MIT's ultrasonic inspection equipment solutions are recognized as the best solutions by global top-tier semiconductor companies, and we are growing as a world-leading company in the non-contact inspection equipment market.