WIRE AND SEALING INSPECTION

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POLLUTION  AND EPOXY BOND INSPECTION

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SOLDERING ON CAMERA MODULE INSPECTION

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SOLDERING ON CAMERA MODULE INSPECTION

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FLUX ON PCB INSPECTION

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SOLDERING PAD INSPECTION

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EPOXY UNDER-FILL AND GLOBE TOP INSPECTION

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CRACK ON CHIP INSPECTION

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DIE SURFACE INSPECTION

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PCB KEFT INSPECTION AFTER LASER CUTTING

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BALL ON BGA INSPECTION

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WIRE INSPECTION

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DISCOLOR INSPECTION AFTER PLATING

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EPOXY INSPECTION AFTER SEALING ON LED CHIP

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BUS BARS AND FINGERS INSPECTION ON SOLAR CELL WAFER

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