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게이밍 기어

Software Platform

I   Machine and Control Software

I   Software Platform

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I   Network Motion System

I   Ultrasonic Inspection Platform

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Smart Factory

I   M-CIM 30 / 300 for MES with SECS/GEM

I   Smart Factory, CIM, SECS/GEM

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I   M-CIM 300 based GEM 300

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Machine Vision

I   Wire and Sealing Inspection

I   Pollution and Epoxy Bond Inspection

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I   Soldering on Camera Module Inspection

I   Soldering on Camera Module Inspection

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I   Flux on PCB Inspection

I   Soldering Pad Inspection

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I   Epoxy Under-Fill and Globe Top Inspectoin

I   Crack on Chip Inspection

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I   DIE Surface Inspection

I   PCB Kerf Inspection after Laser Cutting

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I   Ball in BGA Inspection

I   Wire Boading Inspection

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I   Discolor Inspection after Plating

I   Epoxy Inspection after Sealing on LED Chip

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I   Bus Bars and Fingers Inspection
    on Solar Cell Wafer

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