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Software Platform
I Machine and Control Software
I Software Platform


I Network Motion System


Smart Factory
I M-CIM 30 / 300 for MES with SECS/GEM
I Smart Factory, CIM, SECS/GEM



I M-CIM 300 based GEM 300


Machine Vision
I Wire and Sealing Inspection
I Pollution and Epoxy Bond Inspection


I Soldering on Camera Module Inspection
I Soldering on Camera Module Inspection


I Flux on PCB Inspection
I Soldering Pad Inspection


I Epoxy Under-Fill and Globe Top Inspectoin
I Crack on Chip Inspection


I DIE Surface Inspection
I PCB Kerf Inspection after Laser Cutting


I Ball in BGA Inspection
I Wire Boading Inspection


I Discolor Inspection after Plating
I Epoxy Inspection after Sealing on LED Chip


I Bus Bars and Fingers Inspection
on Solar Cell Wafer

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